Manufacturing method of semiconductor device having underfill resin formed without void between semiconductor chip and wiring board

A manufacturing method of a semiconductor device, the semiconductor device including,

• a semiconductor chip including a bump provided on the semiconductor chip;
• a wiring board including a board main body and a pad provided on a first surface of the board main body, the pad being located where the bump of the semiconductor chip is to be flip chip connected;
• and
• underfill resin configured to seal between the semiconductor chip and the wiring board,
• the method comprising:
• a film state underfill resin adhering step of adhering film state underfill resin in a semi-cured state to the first surface of the board main body without forming a void between the first surface of the board main body and the pad;
• a flattening step of pressing a flat plate onto an upper surface of the film state underfill resin to flatten the upper surface of the film state underfill resin;
• a chip connecting step of pressing the bump of the semiconductor chip onto the flattened upper surface of the film state underfill resin so that the bump of the semiconductor chip is flip chip connected to the pad of the wiring board;
• and
• an underfill resin forming step of curing the film state underfill resin so that the underfill resin is formed between the semiconductor chip and the wiring board,
• wherein the pad of the wiring board is fully covered by the film state underfill resin after the flattening step.