Integrated circuit package system with through semiconductor vias and method of manufacture thereof

A method of manufacture of an integrated circuit package system comprising:

• providing a package substrate having a component side and a system side;
• mounting a first integrated circuit die, having through silicon vias and active side contacts, on the package substrate including coupling a chip interconnect between the through silicon via and the component side of the package substrate, the active side contacts on and extending above the through silicon vias;
• coupling cylindrical studs to the package substrate adjacent to the first integrated circuit die including performing a ball drop process for positioning the cylindrical studs of a specific size, the cylindrical studs the same height as the active side contacts;
• and
• mounting a second integrated circuit die, having through silicon vias, on the first integrated circuit die and the cylindrical studs for forming an electrical connection among the second integrated circuit die, the first integrated circuit die, the package substrate, or a combination thereof including forming system contacts on the system side of the package substrate coupled to the electrical connection.

An integrated circuit package system comprising:

• a package substrate;
• a first integrated circuit die, having through silicon, vias and active side contacts, mounted on the package substrate, the active side contacts on and extending above the through silicon vias;
• cylindrical studs coupled to the package substrate adjacent to the first integrated circuit die, the cylindrical studs the same height as the active side contacts;
• and
• a second integrated circuit die, having through silicon vias, mounted on the first integrated circuit die and the cylindrical studs provide an electrical connection among the second integrated circuit die, the first integrated circuit die, the package substrate, or a combination thereof.