Large area integration of quartz resonators with electronics
AssigneeHRL Laboratories, LLC
InventorsDavid T. Chang, Randall L. Kubena
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Abstract
Methods for integrating quartz-based resonators with electronics on a large area wafer through direct pick-and-place and flip-chip bonding or wafer-to-wafer bonding using handle wafers are described. The resulting combination of quartz-based resonators and large area electronics wafer solves the problem of the quartz-electronics substrate diameter mismatch and enables the integration of arrays of quartz devices of different frequencies with the same electronics.
Claims18
A large scale integration of quartz-based devices with an electronics host wafer, wherein the large scale integration is formed by a method comprising the steps of:
- selecting a plurality of quartz-based devices according to their possession of desired characteristics, wherein each selected quartz-based device is attached to an individual handle wafer;
- attaching the quartz-based devices to the electronics host wafer to form an array of quartz-based devices on the electronics host wafer;
- bonding the quartz-based devices to the electronics host wafer;
- and
- removing the individual handle wafers from the quartz-based devices.
A large scale integration of quartz-based resonators with an electronics host wafer, wherein the large scale integration is formed by a method comprising the steps of:
- providing a plurality of quartz-based resonators possessing desired resonant frequencies, each of the resonators having at least one electrode formed on a first surface of the quartz-based resonator and being attached to an individual handle wafer;
- placing the plurality of quartz-based resonators in contact with the electronics host wafer to form an array of quartz-based resonators on a surface of the electronics host wafer wherein the electrode of each quartz-based resonator is in electrical communication with an electrode disposed on the surface of the electronics host wafer;
- bonding the plurality of quartz-based resonators to the electronics host wafer;
- and
- removing the individual handle wafers from the plurality of quartz-based resonators.
Dependencies are inferred from the claim text.