Method of forming thin profile WLCSP with vertical interconnect over package footprint

A method of manufacturing a semiconductor device, comprising:

• providing a semiconductor wafer having a plurality of first semiconductor die each with an active surface;
• mounting a second semiconductor die to the first semiconductor die, the active surface of the first semiconductor die being oriented toward an active surface of the second semiconductor die;
• forming a vertical interconnect structure around the second semiconductor die;
• depositing an encapsulant over the first and second semiconductor die;
• removing a portion of a back surface of the second semiconductor die opposite the active surface;
• forming a build-up interconnect structure over the back surface of the second semiconductor die, encapsulant, and vertical interconnect structure, the build-up interconnect structure being electrically connected to the vertical interconnect structure;
• removing a portion of a back surface of the first semiconductor die opposite the active surface;
• and
• singulating the semiconductor wafer into individual semiconductor devices.

A method of manufacturing a semiconductor device, comprising:

• providing a first semiconductor die having an active surface;
• mounting a second semiconductor die to the first semiconductor die, the active surface of the first semiconductor die being oriented toward an active surface of the second semiconductor die;
• forming a vertical interconnect structure around the second semiconductor die;
• depositing an encapsulant over the first and second semiconductor die;
• removing a portion of a back surface of the second semiconductor die opposite the active surface;
• forming a build-up interconnect structure over the back surface of the second semiconductor die, encapsulant, and vertical interconnect structure, the build-up interconnect structure being electrically connected to the vertical interconnect structure;
• and
• removing a portion of a back surface of the first semiconductor die opposite the active surface.