MEMS device with stress isolation and method of fabrication

A method for fabricating a microelectromechanical systems (MEMS) device isolated from a substrate comprising:

• forming a first structural layer on a first sacrificial layer overlying said substrate to produce first and second elements separated from one another by a trench, said forming said first structural layer producing a fourth element separated from said first and second elements by additional trenches;
• depositing a second sacrificial layer over said first structural layer, said second sacrificial layer at least partially filling said trench and said additional trenches;
• creating an opening through said second sacrificial layer to expose a portion of said second element, said creating activity further creating a second opening through said second sacrificial layer that exposes a second portion of said fourth element;
• forming a second structural layer over said second sacrificial layer to produce a third element, said second structural layer filling said opening to provide a junction between said second element and said third element, said forming said second structural layer producing a fifth element, said second structural layer filling said second opening to provide a second junction between said fifth element and said fourth element;
• and
• suspending said first, second, third, fourth, and fifth elements over said substrate by removing at least portions of said first and second sacrificial layers, wherein attachment of said second element with said substrate occurs only at a central area on said substrate relative to a location of said first, second, and third elements over said substrate, attachment of said fourth element with said substrate occurs only at said central area of said substrate, said third element is connected to said second element at least via said junction, and said fifth element is connected to said fourth element via said second junction.

A method for fabricating a microelectromechanical systems (MEMS) device isolated from a substrate comprising:

• forming a first structural layer on a first sacrificial layer overlying said substrate to produce first and second elements separated from one another by a trench, said forming said first structural layer producing said first element having projections and producing said second element having a plurality of fingers interleaved with said projections;
• depositing a second sacrificial layer over said first structural layer, said second sacrificial layer at least partially filling said trench;
• creating openings through said second sacrificial layer that expose a portion of each of said plurality of fingers;
• forming a second structural layer over said second sacrificial layer to produce a third element, said forming said second structural layer comprising:
• filling each of said openings to provide multiple junctions;
• and
• forming said third element in said second structural layer as a beam coupled to each of said junctions so that said plurality of fingers are interconnected by said beam, and said projections are not connected to said beam;
• and,
• suspending said first, second, and third elements over said substrate by removing at least portions of said first and second sacrificial layers, wherein attachment of said second element with said substrate occurs only at a central area on said substrate relative to a location of said first, second, and third elements over said substrate, and said third element is connected to said second element at least via said junctions.

A method for fabricating a microelectromechanical systems (MEMS) device isolated from a substrate comprising:

• forming a first structural layer on a first sacrificial layer overlying said substrate to produce first and second elements separated from one another by a trench, wherein said forming said first structural layer produces said first element as a first beam and produces said second element as a second beam;
• depositing a second sacrificial layer over said first structural layer, said second sacrificial layer at least partially filling said trench;
• creating first openings through said second sacrificial layer that expose first portions of said first beam and creating second openings through said second sacrificial layer that expose second portions of said second beam;
• forming a second structural layer over said second sacrificial layer to produce third and fourth elements, said forming said second structural layer comprising:
• filling said first and second openings to provide respective first and second junctions;
• producing a movable element having a first anchor for attachment of said movable element to said substrate, said movable element being movable relative to a plane of said substrate, said movable element including projections;
• forming said third element as a first immovable element having a second anchor at said central area, said third element including a plurality of first fingers, said first junctions coupling said plurality of first fingers with said first beam so that said first fingers of said first immovable element are interconnected;
• and
• producing a fourth element as a second immovable element having a second anchor at said central area, said fourth element including a plurality of second fingers, said second junctions coupling said plurality of second fingers with said second beam so that said second fingers are interconnected, wherein said first and second fingers are interleaved with said projections;
• and
• suspending said first, second, and third elements over said substrate by removing at least portions of said first and second sacrificial layers, wherein attachment of said second element with said substrate occurs only at a central area on said substrate relative to a location of said first, second, and third elements over said substrate.

A method for fabricating a microelectromechanical systems (MEMS) device isolated from a substrate comprising:

• forming a first structural layer on a first sacrificial layer overlying said substrate to produce first and second elements separated from one another by a trench;
• depositing a second sacrificial layer over said first structural layer, said second sacrificial layer at least partially filling said trench;
• creating an opening through said second sacrificial layer to expose a portion of said second element;
• forming a second structural layer over said second sacrificial layer to produce a third element, said second structural layer filling said opening to provide a junction between said second element and said third element;
• and
• suspending said first, second, and third elements over said substrate by removing at least a portion of said first sacrificial layer and removing substantially an entirety of said second sacrificial layer, wherein attachment of said second element with said substrate occurs only at a central area on said substrate relative to a location of said first, second, and third elements over said substrate, and said third element is connected to said second element at least via said junction.