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US 8,137,580 B2Granted
CMP slurry composition for forming metal wiring line
AssigneeLG Chem, Ltd.
InventorsDong-Mok Shin, Eun-Mi Choi, Seung-Beom Cho, Hyun-Chul Ha
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Abstract
Disclosed is CMP slurry, which includes a pyridine-based compound including at least two pyridinyl groups, and minimizes the occurrence of dishing and erosion of a wiring line.
Claims15
CMP slurry comprising an abrasive, an oxidant, a complexing agent, a pyridine-based compound represented by Formula 1 or Formula 2, and water,
- wherein n is 1;
- A represents C1˜C5 alkylene or C2˜C5 alkenylene;
- and each of R1 and R2 independently represents H, OH, or CO2H;
- wherein X represents CH or N;
- each of A1, A2, and A3 independently represents NH, C1˜C5 alkylene or C2˜C5 alkenylene;
- each of n, m, and l independently represents an integer 0 or 1, and herein, at least two of n, m, and l are 1;
- and each of R1, R2, and R3 independently represents H, OH, or CO2H.
4 more elements
Dependencies are inferred from the claim text.