Method for manufacturing perpendicular magnetic recording head

A method for manufacturing a perpendicular magnetic recording head, the method comprising:

• forming a first auxiliary magnetic pole above a wafer;
• forming a coil above the first auxiliary magnetic pole;
• forming a magnetic film above the coil;
• forming a mask member on the magnetic film;
• performing reactive ion etching (RIE) on the mask member to form a mask;
• and
• performing ion milling on the mask under a condition that a milling rate at a central portion of the wafer is higher than a milling rate at an outer peripheral portion of the wafer in order to correct a difference between a large width of the mask located at the central portion of the wafer and a small width of the mask located at the outer peripheral portion of the wafer, and performing ion milling on the magnetic film to form a main magnetic pole, the difference occurring during the reactive ion etching (RIE);
• and
• cutting the wafer.

A method for manufacturing a perpendicular magnetic recording head, comprising the steps of:

• forming a magnetic film above a wafer;
• forming a mask member on the magnetic film;
• performing reactive ion etching (RIE) on the mask member to form a mask;
• performing ion milling on the mask under a condition that a milling rate at a central portion of the wafer is higher than a milling rate at an outer peripheral portion of the wafer in order to correct a difference between a large width of the mask located at the central portion of the wafer and a small width of the mask located at the outer peripheral portion of the wafer, and performing ion milling on the magnetic film to form a main magnetic pole, the difference occurring during the reactive ion etching (RIE);
• forming a coil above the main magnetic pole;
• forming an auxiliary magnetic pole above the coil;
• and
• cutting the wafer.