Sputtering cathode, sputtering apparatus provided with sputtering cathode, film-forming method, and method for manufacturing electronic device

A sputtering cathode comprising a plurality of magnet units arranged at positions opposite to a surface for supporting a target,

• each of the magnet units having:
• a magnet of the magnet unit;
• a distance adjusting mechanism for adjusting a distance from the magnet to the surface;
• a reciprocating movement mechanism for reciprocating the magnet in parallel to the surface;
• and
• a guide part configured so that the reciprocating movement mechanism is moved in a direction of the reciprocating,
• wherein the guide part is engaged with the reciprocating movement mechanism so that the reciprocating movement mechanism moves in the direction of the reciprocating, and is connected to the distance adjusting mechanism,
• the distance adjusting mechanism and the guide part are provided so that the distance adjusting mechanism and the guide part do not move in the direction of the reciprocating when the reciprocating movement mechanism moves in the direction of the reciprocating, and
• wherein magnet units are arranged along a direction different from the direction of the reciprocating.