Method for cleaning elements in vacuum chamber and apparatus for processing substrates
AssigneeTokyo Electron Limited
InventorsTsuyoshi Moriya, Hiroshi Nagaike, Hiroyuki Nakayama
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AssigneeTokyo Electron Limited
InventorsTsuyoshi Moriya, Hiroshi Nagaike, Hiroyuki Nakayama
Estimating the term…
To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.
An element cleaning method for scattering particles sticking to an element in a process chamber and removing the particles by using a gas flow, comprising the steps of:
Dependencies are inferred from the claim text.