Dual zone gas injection nozzle
AssigneeApplied Materials, Inc.
InventorsWei Liu, Johanes S. Swenberg, Hanh D. Nguyen, Son T. Nguyen, Roger Curtis, Philip A. Bottini
Life of this patent
Estimating the term…
Loading patent…
AssigneeApplied Materials, Inc.
InventorsWei Liu, Johanes S. Swenberg, Hanh D. Nguyen, Son T. Nguyen, Roger Curtis, Philip A. Bottini
Estimating the term…
The present invention generally provides apparatus and method for processing a substrate. Particularly, the present invention provides apparatus and methods to obtain a desired distribution of a process gas. One embodiment of the present invention provides an apparatus for processing a substrate comprising an injection nozzle having a first fluid path including a first inlet configured to receive a fluid input, and a plurality of first injection ports connected with the first inlet, wherein the plurality of first injection ports are configured to direct a fluid from the first inlet towards a first region of a process volume, and a second fluid path including a second inlet configured to receive a fluid input, and a plurality of second injection ports connected with the second inlet, wherein the second injection ports are configured to direct a fluid from the second inlet towards a second region of the process volume.
An apparatus for processing a substrate, comprising:
An apparatus for processing a substrate, comprising:
A gas supply assembly for providing gas to a semiconductor processing chamber, comprising:
An apparatus for processing a substrate, comprising:
Dependencies are inferred from the claim text.