Semiconductor wafer polishing machine

A machine for polishing a plurality of wafers, comprising:

• a table base having a platen rotatably attached to said table base, wherein said platen has a flat upper surface adapted to hold a polishing pad;
• and
• a lid comprising:
• a head moving assembly attached to said lid;
• and
• four head assemblies rotatably attached to said head moving assembly, wherein each of said four head assemblies is adapted to hold at least one wafer, said head moving assembly is adapted for reciprocating linear motion in a plane parallel to said flat upper surface of said platen, all of said four head assemblies are simultaneously movable in a same direction of linear motion by said head moving assembly, and during wafer polishing all wafers attached to said four head assemblies simultaneously contact said polishing pad on said platen.

A machine for polishing a plurality of wafers, comprising:

• a table base having a platen rotatably attached to said table base, said platen having a flat upper surface adapted to hold a polishing pad;
• and
• a lid comprising:
• a head moving assembly attached to said lid;
• four head assemblies rotatably attached to said head moving assembly;
• and
• a drive box connected to said head moving assembly, said drive box further comprising:
• four head assembly pulleys, one of each of said four head assembly pulleys attached to one of each of said four head assemblies;
• a head assembly motor attached to said drive box;
• a drive motor pulley attached to said head assembly motor;
• and
• a rotational coupling means coupled to said drive motor pulley and to all of said four head assembly pulleys,
• wherein each of said four head assemblies is adapted to hold at least one wafer, said head moving assembly is adapted for reciprocating linear motion in a plane parallel to said flat upper surface of said platen, and a rotation of said drive motor pulley causes all of said four head assemblies to rotate in a same direction of rotation at a same rate of rotation.