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US 8,136,716 B2Granted
Soldering work piece, soldering method and heat exchanger
AssigneeBehr GmbH & Co.
InventorsWolfgang Heeb, Wolfgang Knödler, Cord Völker
Life of this patent
Estimating the term…
Abstract
The invention relates to a soldering work piece made of aluminium and/or aluminium compounds, to a soldering method, in addition to a heat exchanger soldered in said manner. One surface of the soldering work piece is provided with an artificially applied oxide layer.
Claims21
A soldering workpiece, comprising:
- a soldering workpiece made from aluminum and/or aluminum compounds, wherein the workpiece comprises at a surface a solder plating comprising an aluminum compound,
- an oxide and/or hydroxide layer arranged at a surface of the solder plating, and
- wherein a thickness d of the oxide and/or hydroxide layer is greater than a native thickness of the oxide and/or hydroxide layer of the aluminum and/or aluminum compound formed in ambient air,
- wherein the thickness d of the oxide and/or hydroxide layer is greater than 25 nm, and
- wherein the soldering workpiece is a workpiece configured to be joined to another soldering workpiece, wherein the thickness d of the oxide and/or hydroxide layer, which is greater than 25 nm, is present prior to the soldering workpiece being joined to the another soldering workpiece and wherein the soldering workpiece having the oxide and/or hydroxide layer thereon does not include a joint prior to joining the soldering workpiece to the another soldering workpiece.
2 more elements
A soldering workpiece, comprising:
- a soldering workpiece made from aluminum and/or aluminum compounds, wherein the workpiece comprises at a surface a solder plating comprising an aluminum compound,
- an oxide and/or hydroxide layer located at a surface of the solder plating with a thickness sufficient to provide contact between a soldering compound and the solder plating underneath the oxide and/or hydroxide layer during a subsequent soldering process, and
- wherein the oxide and/or hydroxide layer includes inhomogeneities introduced into the oxide and/or hydroxide layer,
- wherein the thickness of the oxide and/or hydroxide layer is greater than a native thickness of the oxide and/or hydroxide layer,
- wherein the thickness of the oxide and/or hydroxide layer is greater than 25 nm, and
- wherein the soldering workpiece is a workpiece configured to be joined to another soldering workpiece, wherein the thickness of the oxide and/or hydroxide layer, which is greater than 25 nm, is present prior to the soldering workpiece being joined to the another soldering workpiece and wherein the soldering workpiece having the oxide and/or hydroxide layer thereon does not include a joint prior to joining the soldering workpiece to the another soldering workpiece.
3 more elements
Dependencies are inferred from the claim text.