Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsAkihiko Nakamura, Atsushi Miyanari, Yoshihiro Inao
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsAkihiko Nakamura, Atsushi Miyanari, Yoshihiro Inao
Estimating the term…
An attaching device which makes it possible to accurately perform alignment when the diameters of a substrate and a supporting plate are substantially the same includes a mounting plate for mounting a semiconductor wafer thereon, a pressing plate for pressing a supporting plate onto the semiconductor wafer, and a pair of alignment members. The pair of alignment members are arranged to freely move back and forth in a horizontal direction, and blades for supporting a lower surface of the periphery of the supporting plate and pushing members for performing positioning in a state where the supporting plate is superposed on the semiconductor wafer are provided at tip ends of the alignment members.
An attaching device for attaching a supporting plate to a surface of a substrate with an adhesive comprising:
Dependencies are inferred from the claim text.