Process for producing glass substrate and glass substrate
AssigneeNippon Electric Glass Co., Ltd.
InventorsYoshinari Kato, Eiji Matsuki
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Abstract
Provided are a process for producing a glass substrate usable for low-temperature p-SiTFT substrates directly in accordance with a down draw method, and the glass substrate obtained by the process. The process for producing a glass substrate includes a forming step of forming a molten glass into a ribbon shape in accordance with a down draw method, an annealing step of annealing the glass ribbon, and a cutting step of cutting the glass ribbon to give a glass substrate, in which, in the annealing step, an average cooling rate from the annealing point to the (annealing point −50° C.) is lower than an average cooling rate from the (annealing point +100° C.) to the annealing point.
Claims13
A process for producing a glass substrate, comprising:
- a forming step of forming a molten glass into a ribbon shape in accordance with a down draw method,
- an annealing step of annealing said glass ribbon, and
- a cutting step of cutting said glass ribbon to give a glass substrate,
- wherein the annealing step comprises a first annealing stage of cooling the glass ribbon from (annealing point +100° C.) to the annealing point and a second annealing stage of cooling the glass ribbon from the annealing point to (annealing point −50° C.),
- wherein an average cooling rate in the second annealing stage is 10° C./min or more lower than an average cooling rate in the first annealing stage.
A process for producing a glass substrate, comprising:
- a forming step of forming a molten glass into a ribbon shape in accordance with a down draw method,
- an annealing step of annealing said glass ribbon, and
- a cutting step of cutting said glass ribbon to give a glass substrate, wherein the annealing step includes;
- a first annealing stage of cooling the glass to the annealing point, wherein the first annealing stage is defined as from (annealing point +100° C.) to the annealing point,
- a second annealing stage of cooling the glass down from the annealing point to Tx, wherein Tx is a temperature falling between the (annealing point −50° C.) and the (annealing point −200° C.), and
- a third annealing stage of cooling the glass down to (Tx −250° C.), and
- an average cooling rate in the second annealing stage is 10° C./min or more lower than an average cooling rate in the first annealing stage.
Dependencies are inferred from the claim text.