Integrated heat spreader and method of fabrication
AssigneeIntel Corporation
InventorKazuo Ogata
Life of this patent
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Abstract
An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.
Claims12
An integrated heat spreader comprising:
- a center region;
- and
- a periphery region having at least two raised portions interposing the center region to provide a recess there between, the recess having a bottom surface having a plurality of grooves formed therein extending between the at least two raised portions, the grooves extending along a periphery of the bottom surface which is substantially free of the raised portions, and wherein the grooves have a length between about 70% to 90% of a length between the at least two raised portions.
An integrated heat spreader comprising:
- a center region;
- and
- a periphery region having at least two raised portions interposing the center region to provide a recess there between, the recess having a bottom surface having a plurality of grooves formed therein extending between the at least two raised portions, and wherein the grooves have a length between about 70% to 90% of a length between the at least two raised portions.
Dependencies are inferred from the claim text.