Positioning device and method for transferring electronic components using optical alignment
AssigneeMuehlbauer AG
InventorGerhard Schiller
Life of this patent
Estimating the term…
Abstract
A positioning apparatus for transferring at least one electronic component, in particular a chip, from a first flat support to at least one predetermined location on a second flat support which extends parallel to the first support, comprising an ejection device for removing the component from the first support by means of an ejection movement, wherein a camera device is provided for detecting position data of the predetermined location, of the component to be removed from the first support and optionally of the ejection device, which together with the camera device are arranged essentially on an imaginary common straight line. A positioning method is also described.
Claims16
A positioning apparatus for transferring at least one electronic component, comprising:
- a first flat support;
- a second flat support which extends parallel to the first flat support,
- wherein the apparatus is configured for transferring at least one electronic component from the first flat support to at least one predetermined bond location on the second flat support,
- a flat support element of the apparatus, positioned to provide structural support for the second flat support,
- a camera device configured for detecting position data of the at least one predetermined bond location and of the at least one electronic components to be removed from the first flat support;
- and
- an ejection device for removing the at least one electronic component from the first flat support by an ejection movement,
- wherein the camera device, the flat support element of the apparatus, the second flat support, the first flat support, and the ejection device, in this order, are arranged along a common straight line, and
- wherein the flat support element of the apparatus is optically transparent, and
- wherein at least a portion of the second flat support is optically transparent to allow the camera device to make optical contact with both the at least one electronic component to be removed and the at least one predetermined bond location.
Dependencies are inferred from the claim text.