Read sensors and methods of making same with back-edge milling and refilling
AssigneeHitachi Global Storage Technologies Netherlands B.V.
InventorsHardayal S. Gill, Wipul P. Jayasekara
Life of this patent
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Abstract
Methods and apparatus provide a refill configuration adjacent a back-edge that defines a height of a magnetoresistive read sensor. Milling through layers of the sensor forms the back-edge and may be initially conducted at a first angle of incidence greater than a second angle of incidence. In combination, an insulating material and a polish resistant material, such as a non-magnetic metal, disposed on the insulating material fills a void created by the milling. The sensor further includes first and second magnetic shields with the layers of the sensor along with the polish resistant material and insulating material disposed between the first and second magnetic shields.
Claims14
A method of forming a magnetoresistive (MR) read sensor, comprising:
- providing a MR sensor stack on a first magnetic shield;
- removing a portion of the MR sensor stack to form a back-edge of the MR sensor stack, wherein the back-edge defines a height of the MR sensor stack in a direction perpendicular to a track width direction;
- depositing an insulating layer on the back-edge of the MR sensor stack;
- depositing a non-magnetic polish resistant layer on the insulating layer, wherein the non-magnetic polish resistant layer has a slower polishing rate than the insulating layer;
- and
- depositing a second magnetic shield over the MR sensor stack and the polish resistant layer.
A method of forming a magnetoresistive (MR) read sensor, comprising:
- providing a MR sensor stack disposed on a first magnetic shield;
- initially milling a portion of the MR sensor stack at a first angle;
- further milling the portion of the MR sensor stack at a second angle smaller than the first angle to form a back-edge of the MR sensor stack, wherein the further milling removes part of the first magnetic shield;
- depositing an insulating layer on the back-edge of the MR sensor stack to partially fill a void created by the milling;
- depositing a metallic non-magnetic layer on the insulating layer to complete filling of the void, wherein the metallic non-magnetic layer has a slower polishing rate than the insulating layer;
- and
- depositing a second magnetic shield over the MR sensor stack and the polish resistant layer.
Dependencies are inferred from the claim text.