Method of forming a coupled coil arrangement
AssigneeSiemens Aktiengesellschaft
InventorsGraham Hutton, M'Hamed Lakrimi, Adrian Mark Thomas
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Abstract
A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material during the encapsulation process.
Claims12
A method of forming an encapsulated coupled coil arrangement, the method comprising:
- coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy;
- and
- encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material, the jointing alloy having a melting point higher than a highest temperature experienced by the encapsulation material during the encapsulation process, wherein the encapsulation material is a thermoset material.
Dependencies are inferred from the claim text.