Method for fabricating a multi-layer capacitor
AssigneeMax-Planck-Gesellschaft zur Forderung der Wissenschaften e.V.
InventorOliver G. Schmidt
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Abstract
The method comprises fabricating a layer stack on a substrate, the layer stack comprising at least two electrically conducting layers and at least one electrically insulating layer arranged between the two electrically conducting layers, and displacing a first portion of the layer stack away from its original position, the first portion comprising an edge portion of the layer stack, and bending the first portion back towards a second portion of the layer stack. The bending may comprise a rolling-up of the first portion of the layer stack.
Claims11
A method for fabricating a capacitor, the method comprising
- fabricating a layer stack on a substrate, the layer stack comprising at least two electrically conducting layers and at least one electrically insulating layer arranged between the two electrically conducting layers,
- applying a first metal contact to an exposed region of a first one of the at least two electrically conducting layers,
- applying a second metal contact to an exposed region of a second one of the at least two electrically conducting layers,
- displacing a first portion of the layer stack away from its original position, the first portion comprising an edge portion of the layer stack, and
- bending the first portion back towards a second portion of the layer stack.
Dependencies are inferred from the claim text.