Data storage system with removable memory module having parallel channels of DRAM memory and flash memory

#Embodiments of the invention relate to data storage in a computer system. Specifically, embodiments relate to flash DRAM usage in a system.

#Enterprise class storage requires a highly reliable storage medium with very fast performance. The present solutions that exist today fall loosely into one of two areas: Hard disk drive (HDD) based platforms or solid state disk (SSD) based platforms. Both solutions accomplish the same effect, that of allowing users to access long term storage via some means of communication such as Ethernet. Where they differ however is their expense, performance, power requirements, and area requirements. The HDD based solutions are generally less expensive, have less performance, consumer more power and require more physical space. In contrast, the SSD based storage solutions are generally much more expensive, have much more performance, consume more power and require less physical space.

#One major issue for either an SSD or HDD based enterprise class storage device is that the host, typically some form of Intel x86 class of computer must run a disk operating system (DOS) in order to be able to communicate between the application request for data (e.g. a file) and the actual physical contents on HDD(s) or SSD(s). In conventional HDD and SSD systems, the host controls everything that the drive does. Essentially the drive is “dumb” because it only knows how to respond for requests for a sector of data. As such, there is a centralized bottleneck that forces some number of HDDs or SSDs to be attached to a host so the host can convert between the file request and actual sector address of the data on the drives.

#The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention, and together with the description, serve to explain the principles of the invention. In the drawings:

#FIG. 1A shows a front side of a memory module in accordance with an embodiment of the present invention;

#FIG. 1B shows a back side of the memory module of FIG. 1A in accordance with an embodiment of the present invention;

#Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with the preferred embodiments, it will be understood that they are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the invention as defined by the appended claims. Furthermore, in the following detailed description of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be obvious to one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the present invention.

#FIGS. 1A-1B show a memory module 100 that includes a circuit board 101 and an integrated circuit device 130 having configurable logic. In the present embodiment integrated circuit device 130 is a field programmable gate array device that is attached to circuit board 101. However, alternatively, integrated circuit device 130 can also be a programmable logic device (PLD) or other type of device having configurable logic.

#Memory module 100 includes Dynamic Random Access Memory (DRAM) devices 120-129, flash memory devices 140-160, optional battery 132 and interface 170. Interface 170 is electrically coupled to integrated circuit device 130 for coupling input and output between integrated circuit device 130 and external circuitry. In the present embodiment interface 170 is a card-edge connector that is configured to be coupled to a socket of a memory storage device such that the memory module can be inserted into the socket for adding memory to the memory storage device and such that the memory module can be removed from the socket for removing memory from the memory storage device.