Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment

A manufacturing method of a printed-wiring board with a first electronic component, comprising:

• mounting the first electronic component on a first base member, the first electronic component having a through-electrode;
• stacking a second base member on an insulating layer covering the first electronic component;
• forming a tapered, continuous via hole conductor that communicates electrically with the through-electrode of the first electronic component in the second base member and in the insulating layer;
• and
• joining an electrode of a second electronic component to the through-electrode by way of the via hole conductor formed in the tapered, continuous via hole of the second base member and the insulating layer;
• wherein the first electronic component is a semiconductor chip component provided with a plurality of through-electrodes, and the location of the hole corresponds to a predetermined one of the plurality of through-electrodes;
• wherein the through-electrodes are divided into a first group of through-electrodes and a second group of through-electrodes, and wherein the first base member comprises a plurality of pads joined to the first group of the through-electrodes, and wherein the second base member comprises a plurality of vias joined to the second group of the through-electrodes.

An electronic device comprising:

• an electronic equipment main body, and a circuit board provided in the electronic equipment main body, wherein the circuit board comprises:
• a first base member including a component mounting face for a first electronic component;
• a semiconductor chip with a through-electrode mounted on the component mounting face;
• a second base member stacked on an insulating layer covering the semiconductor chip;
• a tapered, continuous via hole conductor provided in the second base member and in the insulating layer and communicating to communicate electrically with the through-electrode;
• and
• a second electronic component mounted on the second base member and comprising an electrode electrically connected directly to the through-electrode by way of the via hole conductor formed in the hole tapered, continuous via hole of the second base member and the insulating layer;
• wherein the first electronic component is a semiconductor chip component provided with a plurality of through-electrodes, and the location of the hole corresponds to a predetermined one of the plurality of through-electrodes;
• wherein the through-electrodes are divided into a first group of through-electrodes and a second group of through-electrodes, and wherein the first base member comprises a plurality of pads joined to the first group of the through-electrodes, and wherein the second base member comprises a plurality of vias joined to the second group of the through-electrodes.