Junction structure of substrate and joining method thereof
AssigneePanasonic Corporation
InventorsMasahiro Yamazaki, Yasumasa Shibata, Yasuo Ueda
Life of this patent
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Abstract
A junction structure and a joining method of substrates are provided that stably can join the substrates and achieve high workability during joining. A second substrate 2 to be joined with solder to a first substrate 1 is bent with elasticity generated by a bending portion 9, and first joints 5 on the first substrate 1 and second joints 6 on the second substrate 2 are joined with solder in a state in which the first substrate 1 is brought into contact with, in a direction that increases the bending angle of the bending portion 9, a part where the joints 6 are formed on the second substrate 2.
Claims10
A junction structure of substrates, comprising:
- a first substrate having a first joint formed on its end, and
- a second substrate having a bending portion and a second joint,
- wherein the bending portion of the second substrate exerts an elastic force in a direction that restores the bending portion to be flat,
- said end of the first substrate resists the elastic force, and
- the first joint and second joint are joined with a joining material.
A junction structure of substrates, comprising:
- a first substrate having a first joint formed on its end, and
- a second substrate having elasticity and having a bending portion and a second joint, the second joint facing outwardly
- wherein the bending portion of the second substrate exerts an elastic force,
- the first joint and the second joint are joined with solder, and
- said end of the first substrate is in contact with the second joint of the second substrate in a direction that increases a bending angle of the bending portion.
A junction structure of substrates, comprising:
- a first substrate having a first joint formed on its end, and
- a second substrate having a bending portion and a second joint,
- wherein the bending portion of the second substrate exerts an elastic force in a direction that restores the bending portion to be flat,
- said end of the first substrate resists the elastic force,
- the first joint and second joint are joined with a joining material, and
- an angle between the first substrate and a part where the second joint is formed on the second substrate is an obtuse angle.
A junction structure of substrates, comprising:
- a first substrate having a first joint formed on its end, and
- a second substrate having elasticity and having a bending portion and a second joint, the second joint facing outwardly
- wherein the bending portion of the second substrate exerts an elastic force,
- the first joint and the second joint are joined with solder,
- said end of the first substrate is in contact with the second joint of the second substrate in a direction that increases a bending angle of the bending portion, and
- an angle between the first substrate and a part where the second joint is formed on the second substrate is an obtuse angle.
Dependencies are inferred from the claim text.