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OwnerOlaf Hohlfeld, Peter Kanschat +1inventors
InventorsOlaf Hohlfeld, Peter Kanschat, Thilo Stolze
Estimating the term…
A power semiconductor module system includes a power semiconductor module, a heat sink and at least one fastener. The power semiconductor module includes a bottom side with a first thermal contact surface and the heat sink includes a top side with a second thermal contact surface. The power semiconductor module is conjoined with the heat sink by means of the at least one fastener. The power semiconductor module includes a number N1≧1 of first positioning elements and the heat sink a number N2≧1 of second positioning elements. Each of the first positioning elements corresponds to one of the second positioning elements and forms a pair therewith. The power semiconductor module and the heat sink are alignable relative to one another so that the two positioning elements of each of the pairs are interfitted when the power semiconductor module is mounted on the heat sink.
A power semiconductor module system, comprising:
A method of mounting a power semiconductor module on a heat sink, comprising:
The method as set forth in 18, wherein the first thermal contact surface and the second thermal contact surface are spaced apart from each other when the power semiconductor module is mounted with its bottom side facing downward on the heat sink so that each first positioning element interfits the corresponding second positioning element, and the power semiconductor module is mounted with its bottom side facing downward on the heat sink so that each first positioning element interfits the corresponding second positioning element and the first thermal contact surface and second thermal contact surface have a spacing which is greater than the thickness of the applied heat-conductive paste.
Dependencies are inferred from the claim text.