Method of aligning a substrate
AssigneeSamsung Electronics Co., Ltd.
InventorsJong-Sun Peak, Young-Seok Kim
Life of this patent
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Abstract
In a method of aligning a substrate, a first alignment mark in a single shot region on the substrate may be identified. A second alignment mark in the single shot region may be selectively identified in accordance with the identification of the first alignment mark. The substrate may then be aligned using identified any one of the first alignment mark and the second alignment mark. Thus, although the substrate may be accurately aligned, the accurately aligned substrate may not be determined to be misaligned.
Claims9
A method of aligning a substrate, the method comprising:
- setting an allowable alignment score that is used for determining non-identifications of a first alignment mark and a second alignment mark in one shot region of the substrate;
- setting a final allowable alignment score that is used for finally determining the non-identifications of the first alignment mark and the second alignment mark, the final allowable alignment score lower than the allowable alignment score;
- identifying the first alignment mark to obtain a first alignment score of the first alignment mark;
- comparing the first alignment score with the allowable alignment score;
- comparing the first alignment score with the final allowable alignment score, when the first alignment score is below the allowable alignment score;
- correcting a height of the substrate;
- comparing a first alignment score after correcting the height of the substrate with the final allowable alignment score;
- selectively identifying the second alignment mark to obtain a second alignment score of the second alignment mark, when the first alignment score is below the final allowable alignment score;
- comparing the second alignment score with the allowable alignment score;
- comparing the second alignment score with the final allowable alignment score, when the second alignment score is below the allowable alignment score;
- correcting the height of the substrate;
- comparing a second alignment score after correcting the height of the substrate with the final allowable alignment score;
- and
- aligning the substrate using the first alignment mark or the second alignment mark.
A method of aligning a substrate, the method comprising:
- identifying any one of a first alignment mark and a second alignment mark in a first shot region of the substrate;
- aligning the substrate using any one of the identified first alignment mark and the second alignment mark;
- identifying any one of a third alignment mark and a fourth alignment mark in a second shot region that is located from the first shot region in a first direction;
- aligning the substrate using any one of the identified third alignment mark and the fourth alignment mark;
- identifying any one of a fifth alignment mark and a sixth alignment mark in a third shot region that is located from the first shot region in a second direction substantially perpendicular to the first direction;
- and
- aligning the substrate using any one of the fifth identified alignment mark and the sixth alignment mark.
Dependencies are inferred from the claim text.