Exposure apparatus and method for producing device
AssigneeNikon Corporation
InventorNaoyuki Kobayashi
Life of this patent
Estimating the term…
Abstract
A lens cleaning module is provided for a lithography system having an exposure apparatus including an objective lens. The system includes a scanning stage for supporting a wafer beneath the objective lens. A cleaning module coupling with the lithography system is provided for cleaning the objective lens in a non-manual cleaning process.
Claims28
A lens cleaning module for a liquid immersion lithography system having an exposure apparatus including an objective lens, comprising:
- an immersion fluid supply system from which an immersion liquid is supplied to fill a space between a wafer and the objective lens in a liquid immersion lithography process;
- a scanning stage by which the wafer is supported beneath the objective lens;
- and
- a cleaning module coupling with the liquid immersion lithography system for cleaning the objective lens in a cleaning process, the cleaning module comprising a member and the member being moved below the objective lens,
- wherein the immersion liquid is supplied from the immersion fluid supply system to a space between the objective lens and a surface of the member to clean the objective lens in the cleaning process.
A method for patterning semiconductor wafers by immersion lithography to improve exposure quality comprising:
- filling an immersion liquid between a semiconductor wafer on a stage of an immersion lithography apparatus and an objective lens of the immersion lithography apparatus;
- exposing the semiconductor wafer to a light source having a wavelength of less than about 250 nm through the immersion liquid;
- and
- cleaning a surface of the objective lens after the exposing utilizing a lens cleaning module, wherein the lens cleaning module includes a member, which is moved below the objective lens, and wherein the immersion liquid is supplied to a space between the objective lens and a surface of the member to clean the objective lens.
A method for patterning semiconductor wafers by immersion lithography to improve exposure quality comprising:
- utilizing a lens cleaning module to clean a surface of an objective lens before wafer exposure processing, the lens cleaning module comprising a member and the member being moved below the objective lens;
- filling an immersion liquid between a semiconductor wafer on a stage of an immersion lithography apparatus and the objective lens of the immersion lithography apparatus;
- and
- exposing the semiconductor wafer to a light source having a wavelength of less than about 250 nm through the immersion liquid,
- wherein the immersion liquid is supplied to a space between the surface of the objective lens and a surface of the member to clean the surface of the objective lens.
A lens cleaning module for a liquid immersion lithography system having an exposure apparatus including an objective lens, comprising:
- an immersion fluid supply system from which an immersion liquid is supplied to fill a space between a wafer and the objective lens in a liquid immersion lithography process;
- a scanning stage by which the wafer is supported beneath the objective lens;
- a cleaning module coupling with the lithography system for cleaning the objective lens in a cleaning process, the cleaning module comprising a member and the immersion liquid being supplied to a space between the objective lens and the member to clean the objective lens in the cleaning process;
- and
- a drying module associated with the cleaning module for drying the objective lens.
A method for patterning semiconductor wafers by immersion lithography to improve exposure quality comprising:
- filling an immersion liquid between a semiconductor wafer on a stage of a liquid immersion lithography apparatus and an objective lens of the liquid immersion lithography apparatus;
- exposing the semiconductor wafer to a light source having a wavelength of less than about 250 nm through the immersion liquid;
- and
- cleaning a surface of the objective lens after the exposing utilizing a lens cleaning module, the lens cleaning module comprising a cleaning fluid removing/collecting system and a member and the member being moved below the objective lens,
- wherein the immersion liquid is supplied to a space between the objective lens and a surface of the member to clean the objective lens.
A method for patterning semiconductor wafers by immersion lithography to improve exposure quality comprising:
- utilizing a lens cleaning module to clean a surface of an objective lens before wafer exposure processing, the lens cleaning module comprising a cleaning fluid removing/collecting system and a member and the member being moved below the objective lens;
- filling an immersion liquid between a semiconductor wafer on a stage of a liquid immersion lithography apparatus and the objective lens of the liquid immersion lithography apparatus;
- and
- exposing the semiconductor wafer to a light source having a wavelength of less than about 250 nm through the immersion liquid,
- wherein the immersion liquid is supplied to a space between the surface of the objective lens and a surface of the member to clean the surface of the objective lens.
Dependencies are inferred from the claim text.