Solid-state imaging device, camera, and electronic device

A camera, comprising:

• a solid-state imaging device;
• an optical system configured to lead incident light to a photoelectric conversion element included in the solid-state imaging device:
• and
• a signal processing circuit configured to process output signals from the solid-state imaging device;
• the solid-state imaging device including
• an imaging region including pixels arranged two-dimensionally, each of the pixels including a photoelectric conversion element and a plurality of pixel transistors for reading out signals outputted from the photoelectric conversion element, and
• wirings formed on stacked layers for driving each of the pixels,
• wherein a shading part between the pixels is formed by combining first and second wirings selected from the wirings, wherein
• the first and second wirings in the solid-state imaging device are formed on a single layer,
• the first and the second wirings are formed each having wiring directions intersecting with each other, and
• the first wiring at a location intersecting the second wiring is interconnected by way of connection wirings on a layer different from that of the first wiring.

An electronic device, comprising:

• a camera;
• the camera including
• a solid-state imaging device,
• an optical system configured to lead incident light to a photoelectric conversion element included in the solid-state imaging device, and
• a signal processing circuit configured to process output signals from the solid-state imaging device;
• the solid-state imaging device including
• an imaging region including pixels arranged two-dimensionally, each of the pixels including a photoelectric conversion element and a plurality of pixel transistors for reading out signals outputted from the photoelectric conversion element, and
• wirings formed on stacked layers for driving each of the pixels, wherein
• a shading part between the pixels is formed by combining first and second wirings selected from the wirings, wherein
• the first and second wirings in the solid-state imaging device are
• a power supply wiring and a ground wiring formed on a single layer;
• each formed in a lattice shape partially apart from each other to be combined so that portions are formed as a further lattice structure, each of the portions having an opening spatially corresponding to the photoelectric conversion element included in each of the pixels;
• formed each having wiring directions intersecting with each other;
• and
• the first wiring at a location intersecting the second wiring is interconnected by way of connection wirings on a layer different from that of the first wiring.