Solid-state image-pickup device
AssigneeSony Corporation
InventorHiroaki Ishiwata
Life of this patent
Estimating the term…
Abstract
A solid-state image device including a pixel-array section forming an image pick-up region and a wiring layer including wiring lines and contact units. In one embodiment, each of the contact units and wiring lines is provided for a respective pixel in the pixel-array section, and the image-pickup region is divided into a first region and a second region with respect to a central portion of the image-pickup region. Further, positions of contact units and wiring lines arranged in the first region are opposite to positions of corresponding contact units and wiring lines arranged in the second region.
Claims9
A solid-state image-pickup device comprising:
- a pixel-array section in which a plurality of photoelectric conversion units are arranged two-dimensionally in horizontal and vertical directions on a semiconductor substrate, the pixel-array section forming an image-pickup region;
- a wiring layer on the pixel-array section, the wiring layer including an insulator film and a wiring film that are stacked on the pixel-array section, and the wiring layer including a plurality of first wiring lines that are connected to another layer on a semiconductor substrate side via a like plurality of contact units;
- and
- microlenses arranged on the wiring layer, the microlenses having a pitch that is used for pupil correction, the pitch being different from a pitch of the photoelectric conversion units in the pixel-array section,
- wherein
- the image-pickup region is divided into a plurality of regions with respect to a central portion of the image-pickup region, the plurality of regions including a first region and a second region, each of the plurality of contact units and first wiring lines is provided for a respective pixel in the pixel-array section, and positions of contact units and first wiring lines arranged in the first region are opposite to positions of corresponding contact units and first wiring lines arranged in the second region.
Dependencies are inferred from the claim text.