Two-track surface acoustic wave structure without internal pads
AssigneeRF Micro Devices, Inc.
InventorsAleh Loseu, Jayanti Jaganatha Rao
Life of this patent
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Abstract
The present disclosure relates to a two-track surface acoustic wave (SAW) device that has a reduced size compared to a traditional two-track SAW device by eliminating an internal ground connection node of the traditional two-track SAW device. The internal ground connection node is eliminated by coupling an internal ground interconnection to an external ground connection node through an interconnecting ground grating, which is part of one of two SAW tracks of the two-track SAW device. The internal ground interconnection is located in an internal region of the two-track SAW device that is defined by the two SAW tracks and by two electrical interconnections between the two SAW tracks.
Claims26
A two-track surface acoustic wave (SAW) device comprising:
- a substrate;
- a first SAW track disposed on the substrate;
- a second SAW track disposed on the substrate and comprising a first interconnecting ground grating;
- a first electrical interconnection disposed on the substrate electrically connecting the first SAW track to the second SAW track;
- a second electrical interconnection disposed on the substrate electrically connecting the first SAW track to the second SAW track;
- an internal region defined by the first SAW track, the second SAW track, the first electrical interconnection, and the second electrical interconnection;
- an internal ground interconnection disposed on the substrate in the internal region;
- and
- a first external ground connection node disposed on the substrate outside of the internal region and electrically coupled to the internal ground interconnection through the first interconnecting ground grating.
A method for forming a two-track surface acoustic wave (SAW) device comprising:
- disposing a first SAW track on a substrate;
- disposing a second SAW track on the substrate, such that the second SAW track comprises a first interconnecting ground grating;
- disposing a first electrical interconnection on the substrate, such that the first electrical interconnection electrically connects the first SAW track to the second SAW track;
- disposing a second electrical interconnection on the substrate, such that the second electrical interconnection further electrically connects the first SAW track to the second SAW track;
- providing an internal region defined by the first SAW track, the second SAW track, the first electrical interconnection, and the second electrical interconnection;
- disposing an internal ground interconnection on the substrate in the internal region;
- and
- disposing a first external ground connection node on the substrate, such that the first external ground connection node is electrically coupled to the internal ground interconnection through the first interconnecting ground grating.
Dependencies are inferred from the claim text.