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US 8,134,242 B2Granted
Integrated circuit package system with concave terminal
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Arnel Senosa Trasporto, Reza Argenty Pagaila, Lionel Chien Hui Tay
Life of this patent
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Abstract
An integrated circuit package system includes: connecting a concave terminal and an integrated circuit; and forming an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal within the encapsulation.
Claims20
A method of forming an integrated circuit package system comprising:
- connecting a concave terminal and an integrated circuit, the concave terminal having a curved inner surface and a curved outer surface;
- and
- forming an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal within the encapsulation.
A method of forming an integrated circuit package system comprising:
- connecting a concave terminal and an integrated circuit, the concave terminal having a curved inner surface and a curved outer surface;
- and
- forming an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal arched within the encapsulation and non-planar with the bottom side without extending beyond the bottom side.
An integrated circuit package system comprising:
- a concave terminal having a curved inner surface and a curved outer surface;
- an integrated circuit connected with the concave terminal;
- and
- an encapsulation, having a bottom side, over the integrated circuit and the concave terminal with the concave terminal within the encapsulation.
1 more element
Dependencies are inferred from the claim text.