Semiconductor device and manufacturing method for the same
AssigneeFujitsu Semiconductor Limited
InventorsTakao Nishimura, Yoshiaki Narisawa
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Abstract
To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substrate 10 having an electrode 21A arranged on its surface; and a first semiconductor element 11A which includes an electrode 22 arranged on its surface and which is supported by the substrate 10, wherein a first wire 41 is connected through a first bump 31 to at least one of the electrodes over the substrate 10 and semiconductor element 11A (i.e., at least one of the electrodes 21 and 22), and a second wire 42 is connected through a second bump 32 to a bonding portion of the wire 41.
Claims3
A semiconductor device, comprising:
- a substrate having an electrode arranged on a surface thereof;
- a first semiconductor element which has at least one electrodes arranged on a surface thereof and which is supported by the substrate;
- a first bump arranged on the at least one of the electrodes arranged on the first semiconductor element;
- a first wire connected through the first bump;
- at least one second bump arranged on a bonding portion of the first wire to the first bump;
- a third bump arranged directly on the second bump;
- and
- a second wire connected through the third bump or a fourth bump arranged on the third bump to the second bump.
Dependencies are inferred from the claim text.