Electronic module with switching functions and method for producing the same
AssigneeInfineon Technologies AG
InventorRalf Otremba
Life of this patent
Estimating the term…
Abstract
An electronic module with switching functions includes integrated circuit chips arranged in a chip stack. The integrated circuit chips of the chip stack in each case includes a large-area contact on the top side and/or the rear side, the areal extent of the large-area contact completely occupies the top side and/or the rear side of the integrated circuit chip. A diffusion solder layer is arranged between mutually aligned large-area contacts of the stacked integrated circuit chips, the diffusion solder layer extending as far as the edges of the integrated circuit chips. A method for producing an electronic module with switching functions includes aligning and diffusion-soldering integrated circuit wafers with one another by their rear sides.
Claims10
An electronic module with switching functions, the module comprising:
- a pair of integrated circuit chips arranged in a chip stack to provide the switching functions, wherein each of the integrated circuit chips comprises a first power electrode that is disposed on and completely covers a rear side of the integrated circuit chip, the rear sides of the integrated circuit chips facing toward each other, and each of the integrated circuit chips further comprises a second power electrode covering a majority of the surface of a top side of the integrated circuit chip and a small-area control electrode on the top side that has a smaller dimension than the second power electrode, the top sides of the integrated semiconductor chips facing away from each other;
- and
- a diffusion solder layer arranged between the first power electrodes disposed on the rear sides of the stacked chips, wherein the diffusion solder layer extends to edges of the chips.
An electronic module comprising:
- a pair of integrated circuit chips arranged in a chip stack to provide switching functions, wherein each of the integrated circuit chips includes a top side and a rear side, the integrated circuit chips being arranged such that the rear sides of the chips face toward each other, each of the chips comprises a drain electrode disposed on a rear side of the chip, and each of the integrated circuit chips further comprises a source electrode and a gate electrode disposed at the top side of the chip;
- and
- a diffusion solder layer arranged between the drain electrodes disposed on the rear sides of the stacked chips.
Dependencies are inferred from the claim text.