Three-dimensional semiconductor device

A conductor structure for coupling a component on a first semiconductor chip to a component on a second semiconductor chip, the first semiconductor chip and the second semiconductor chip being assembled in a stacked configuration, the conductor structure comprising:

• a first conductive pad on a first surface of the second semiconductor chip;
• a first conductive via extending from the first conductive pad to a second surface of the second semiconductor chip;
• and
• a second conductive via extending to the second surface of the second semiconductor chip and electrically coupled to the first conductive via;
• wherein the conductor structure is a redundant bonding-conductor structure extending to a bonding surface of the first semiconductor chip.

A 3D semiconductor chip assembly, comprising:

• a first chip comprising a first active area;
• a second chip comprising a second active area and positioned above the first chip;
• and
• a redundant bonding-conductor structure coupling the first active area to the second active area, the redundant bonding-conductor comprising:
• at least two conductive vias extending through the second chip, the at least two conductive vias being electrically coupled together.