Semiconductor chip and semiconductor device
AssigneePanasonic Corporation
InventorsHikari Sano, Yoshihiro Tomita, Takahiro Nakano
Life of this patent
Estimating the term…
Abstract
A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating plug formed in a region of the substrate corresponding to at least one of the semiconductor elements. The heat-radiating plug is made of a material having a thermal conductivity greater than that of the substrate formed in a non-penetrating hole having its opening on a reverse surface of the substrate.
Claims21
A semiconductor chip, comprising:
- a substrate having a front surface and a reverse surface opposite to the front surface;
- an integrated circuit disposed in the front surface of the substrate, the integrated circuit including a plurality of semiconductor elements;
- a first penetrating plug penetrating from the reverse surface of the substrate to a middle of the substrate so that the first penetrating plug is disposed apart from the front surface of the substrate;
- a second penetrating plug penetrating from the reverse surface of the substrate to the front surface of the substrate, wherein:
- an area of a portion of the first penetrating plug that is exposed on the reverse surface is smaller than an area of a portion of the second penetrating plug that is exposed on the reverse surface.
A semiconductor chip, comprising:
- a substrate having a front surface and a reverse surface opposite to the front surface;
- an integrated circuit disposed in the front surface of the substrate, the integrated circuit including a plurality of semiconductor elements;
- a first penetrating hole having a inner side surface and a inner bottom surface being opposed to the reverse surface, the first penetrating hole penetrating from the reverse surface of the substrate to a middle of the substrate so that the inner bottom surface of the first penetrating hole is apart from the front surface of the substrate;
- and
- a first metal film disposed in the first penetrating hole,
- wherein the first metal film has a first depression in a region corresponding to the first penetrating hole.
A semiconductor chip, comprising:
- a substrate having a front surface and a reverse surface opposite to the front surface;
- an integrated circuit disposed in the front surface of the substrate, the integrated circuit including a plurality of semiconductor elements;
- a first penetrating hole having an inner side surface and an inner bottom surface being opposed to the reverse surface, the first penetrating hole penetrating from the reverse surface of the substrate to a middle of the substrate so that the inner bottom surface of the first penetrating hole is apart from the front surface of the substrate;
- and
- a first metal film disposed in the first penetrating hole,
- wherein a diameter of the first penetrating hole is smaller than a height of the first penetrating hole.
A semiconductor chip, comprising:
- a semiconductor substrate having a front surface and a reverse surface opposite to the front surface;
- an integrated circuit disposed in the front surface of the substrate;
- and
- a heat-radiating plug disposed in a first penetrating hole penetrating from the reverse surface of the semiconductor substrate to a middle of the semiconductor substrate so that an inner bottom surface of the first penetrating hole is apart from the front surface of the semiconductor substrate.
Dependencies are inferred from the claim text.