Back to results
US 8,134,230 B2Granted
Sealed joint structure of device and process using the same
AssigneeIndustrial Technology Research Institute
InventorsTsung-Fu Yang, Su-Tsai Lu
Life of this patent
Estimating the term…
Abstract
A sealed joint structure of device includes a buffer bump layer, conductive joint portions and a sealed joint portion. The buffer bump layer disposed between a device and a substrate includes first parts and a second part surrounding the first parts. Each of the conductive joint portions includes a first electrode covering each of the first parts and a second electrode on the substrate, and each of the first electrodes is electrically connected to the second electrode. The sealed joint portion includes a joint ring located on the substrate and is jointed with the second part to form a hermetic space between the device and the substrate.
Claims30
A sealed joint structure of device, for packaging a device on a substrate, the sealed joint structure of device comprising:
- a buffer bump layer, disposed between the device and the substrate, the buffer bump layer comprising a plurality of first parts and a second part, the second part surrounding the plurality of first parts;
- a plurality of conductive joint portions, electrically connected between the device and the substrate, wherein each of the plurality of conductive joint portions comprises a first electrode covering each of the plurality of first parts and a second electrode on the substrate, materials of the first electrodes and the first parts are different, and each of the first electrodes and each of the second electrodes are electrically connected;
- and
- a sealed joint portion, disposed on the substrate and surrounding the plurality of conductive joint portions, the sealed joint portion being jointed with the second part so as to form a hermetic space between the device and the substrate.
1 more element
A process for forming a sealed joint structure of device, comprising:
- providing a first substrate having a device formed thereon;
- forming a buffer layer on the device;
- patterning the buffer layer to form a buffer bump layer comprising a plurality of first parts and a second part, wherein the second part surrounds the plurality of first parts;
- forming a first electrode on each of the plurality of first parts, wherein materials of the first electrodes and the first parts are different;
- providing a second substrate, having a plurality of second electrodes and a sealed joint portion formed on the substrate, the sealed joint portion surrounding the plurality of second electrodes;
- and
- disposing the device on the second substrate, wherein each of the first electrodes corresponds and is electrically connected to each of the plurality of second electrodes, and the sealed joint portion is correspondingly jointed with the second part to form a hermetic space between the device and the second substrate.
4 more elements
A sealed joint structure of device, for packaging a device on a substrate, the sealed joint structure of device comprising:
- a buffer bump layer, disposed between the device and the substrate, the device having a plurality of pads, the buffer bump layer having an outer portion surrounding the plurality of pads;
- a plurality of conductive joint portions, electrically connected between the device and the substrate, wherein each of the plurality of conductive joint portions comprises a metal bump on the device electrically connected to each of the plurality of pads and a second electrode on the substrate, and each of the metal bumps each of the second electrodes are electrically connected, and materials of the metal bumps and the buffer bump layer are different;
- and
- a sealed joint portion, disposed on the substrate, surrounding the plurality of conductive joint portions, and being jointed with the outer portion so as to form a hermetic space between the device and the substrate.
1 more element
A sealed joint structure of device, for packaging a device on a substrate, the sealed joint structure of device comprising:
- a buffer bump layer, disposed between the device and the substrate, the device having a plurality of pads, the buffer bump layer having an outer portion surrounding the plurality of pads;
- a plurality of conductive joint portions, electrically connected between the device and the substrate, wherein each of the plurality of conductive joint portions comprises a metal bump on the device electrically connected to each of the plurality of pads and a second electrode on the substrate, and each of the metal bumps each of the second electrodes are electrically connected, and materials of the metal bumps and the buffer bump layer are different;
- a sealed joint portion, disposed on the substrate, surrounding the plurality of conductive joint portions, and being jointed with the outer portion so as to form a hermetic space between the device and the substrate;
- and
- a first adhesive metal layer between each of the metal bumps and each of the second electrodes.
2 more elements
A sealed joint structure of device, for packaging a device on a substrate, the sealed joint structure of device comprising:
- a buffer bump layer, disposed between the device and the substrate, the device having a plurality of pads, the buffer bump layer having an outer portion surrounding the plurality of pads;
- a plurality of conductive joint portions, electrically connected between the device and the substrate, wherein each of the plurality of conductive joint portions comprises a metal bump on the device electrically connected to each of the plurality of pads and a second electrode on the substrate, and each of the metal bumps each of the second electrodes are electrically connected, and materials of the metal bumps and the buffer bump layer are different;
- a sealed joint portion, disposed on the substrate, surrounding the plurality of conductive joint portions, and being jointed with the outer portion so as to form a hermetic space between the device and the substrate;
- and
- a second adhesive metal layer and a third adhesive metal layer between the joint ring and the annular portion.
2 more elements
A sealed joint structure of device, for packaging a device on a substrate, the sealed joint structure of device comprising:
- a buffer bump layer, disposed between the device and the substrate, the device having a plurality of pads, the buffer bump layer having an outer portion surrounding the plurality of pads;
- a plurality of conductive joint portions, electrically connected between the device and the substrate, wherein each of the plurality of conductive joint portions comprises a metal bump on the device electrically connected to each of the plurality of pads and a second electrode on the substrate, and each of the metal bumps each of the second electrodes are electrically connected, and materials of the metal bumps and the buffer bump layer are different;
- and
- a sealed joint portion, disposed on the substrate, surrounding the plurality of conductive joint portions, and being jointed with the outer portion so as to form a hermetic space between the device and the substrate;
- wherein the substrate further comprises a plurality of third electrodes, and the plurality of third electrodes are electrically connected to the second electrodes through the substrate respectively.
2 more elements
A sealed joint structure of device, for packaging a device on a substrate, the sealed joint structure of device comprising:
- a buffer bump layer, disposed between the device and the substrate, the device having a plurality of pads, the buffer bump layer having an outer portion surrounding the plurality of pads;
- a plurality of conductive joint portions, electrically connected between the device and the substrate, wherein each of the plurality of conductive joint portions comprises a metal bump on the device electrically connected to each of the plurality of pads and a second electrode on the substrate, and each of the metal bumps each of the second electrodes are electrically connected, and materials of the metal bumps and the buffer bump layer are different;
- and
- a sealed joint portion, disposed on the substrate, surrounding the plurality of conductive joint portions, and being jointed with the outer portion so as to form a hermetic space between the device and the substrate;
- wherein the substrate further comprises a plurality of third electrodes, and the plurality of third electrodes are electrically connected to the second electrodes through the substrate respectively;
- wherein each of the plurality of third electrodes further comprises a neuro-stimulating electrode thereon.
3 more elements
A sealed joint structure of device, for packaging a device on a substrate, the sealed joint structure of device comprising:
- a buffer bump layer, disposed between the device and the substrate, the device having a plurality of pads, the buffer bump layer having an outer portion surrounding the plurality of pads;
- a plurality of conductive joint portions, electrically connected between the device and the substrate, wherein each of the plurality of conductive joint portions comprises a metal bump on the device electrically connected to each of the plurality of pads and a second electrode on the substrate, and each of the metal bumps each of the second electrodes are electrically connected, and materials of the metal bumps and the buffer bump layer are different;
- and
- a sealed joint portion, disposed on the substrate, surrounding the plurality of conductive joint portions, and being jointed with the outer portion so as to form a hermetic space between the device and the substrate;
- wherein the substrate further comprises a biocompatible coating to cover the device.
2 more elements
A sealed joint structure of device, for packaging a device on a substrate, the sealed joint structure of device comprising:
- a buffer bump layer, disposed between the device and the substrate, the device having a plurality of pads, the buffer bump layer having an outer portion surrounding the plurality of pads;
- a plurality of conductive joint portions, electrically connected between the device and the substrate, wherein each of the plurality of conductive joint portions comprises a metal bump on the device electrically connected to each of the plurality of pads and a second electrode on the substrate, and each of the metal bumps each of the second electrodes are electrically connected, and materials of the metal bumps and the buffer bump layer are different;
- and
- a sealed joint portion, disposed on the substrate, surrounding the plurality of conductive joint portions, and being jointed with the outer portion so as to form a hermetic space between the device and the substrate;
- wherein each of the metal bumps is disposed on each of the plurality of pads through a under bump metal layer, the under bump metal layer being electrically connected to a first electrode covering each of the metal bumps.
2 more elements
A process for forming a sealed joint structure of device, comprising:
- providing a first substrate having a device formed thereon, the device having a plurality of pads;
- forming a buffer layer on the device;
- patterning the buffer layer to form a buffer bump layer having an outer portion, wherein the outer portion surrounds the plurality of pads;
- forming a plurality of metal bumps on the device, each of the plurality of metal bumps being electrically connected to each of the plurality of pads, wherein materials of the metal bumps and the buffer bump layer are different;
- providing a second substrate, having a plurality of second electrodes and a sealed joint portion formed on the second substrate, the sealed joint portion surrounding the plurality of second electrodes;
- and
- disposing the device on the substrate, wherein each of the plurality of metal bumps corresponds and is electrically connected to each of the plurality of second electrodes, and the sealed joint portion is correspondingly jointed with the outer portion to form a hermetic space between the device and the second substrate.
4 more elements
Dependencies are inferred from the claim text.