Back to results
US 8,134,227 B2Granted
Stacked integrated circuit package system with conductive spacer
AssigneeSTATS ChipPAC, Ltd.
InventorsLionel Chien Hui Tay, Rui Huang, Seng Guan Chow
Life of this patent
Estimating the term…
Abstract
A stacked integrated circuit package system is provided including providing a first device and a second device with the first device, the second device, or a combination thereof having an integrated circuit die; forming a conductive spacer structure over the first device with the conductive spacer structure having a spacer filler around a conductive element; mounting the second device over the conductive spacer structure and the first device; and encapsulating the first device, the second device, and the conductive spacer structure.
Claims10
A stacked integrated circuit package system comprising:
- a first device having an integrated circuit die attached to a mounting structure;
- a conductive element directly on the mounting structure of the first device;
- a conductive spacer structure having a spacer filler around the conductive element;
- a second device over the conductive spacer structure and the first device, the conductive spacer structure directly attached to a non-active side of the second device and the conductive spacer structure between the second device and the first device;
- and
- an encapsulation over the first device, the second device, and the conductive spacer structure.
3 more elements
Dependencies are inferred from the claim text.