Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates

An electronic device, comprising:

• a substrate having at least one passing opening;
• a differential sensor MEMS device having at least a first and a second surface leaving exposed a first and second active surface, respectively;
• a protective package incorporating at least partially said MEMS device and said substrate so as to leave exposed said first and second active surfaces;
• said differential sensor having a portion being sensitive to chemical and/or physical variations of fluids getting in contact with said first and/or second active surface;
• said first surface of said MEMS device facing said substrate and being spaced from said substrate by a distance;
• said second surface being opposed to said first surface and having an opening for exposing said second active surface;
• said sensitive portion being aligned with said passing opening of said substrate.

An electronic device, comprising:

• a substrate having at least one passing opening formed in the substrate, the passing opening being exposed on a first surface of the substrate and on a second surface of the substrate opposing the first surface, and the substrate including at least one electrically conductive layer;
• a differential sensor device including a die having first and second opposing surfaces including first and second active surface portions, respectively, wherein the first surface of the die faces the first surface of the substrate and is spaced a distance from the first surface of the substrate, the second surface of the die having an opening to expose the second active surface portion of the die and the die being physically attached to the substrate to align the first active surface portion of the die with the passing opening of the substrate, and the die being electrically connected to at least some of the electrically conductive layers in the substrate;
• and
• a protective package formed on the substrate and die, the package leaving the first and second active surface portions of the die exposed.

An electronic system, comprising:

• a plurality of electronic devices formed on a substrate, the substrate including, for at least some of the electronic devices, a passing opening formed in the substrate, the passing opening being exposed on a first surface of the substrate and on a second surface of the substrate opposing the first surface, and the substrate including at least one electrically conductive layer;
• wherein the electronic devices include a plurality of differential sensor devices, each differential sensor device including a die having first and second opposing surfaces including first and second active surface portions, respectively, wherein the first surface of the die faces the first surface of the substrate and is spaced a distance from the first surface of the substrate, the second surface of the die having an opening to expose the second active surface portion of the die and the die being physically attached to the substrate to align the first active surface portion of the die with a corresponding one of the passing openings in the substrate, and the die being electrically connected to at least some of the electrically conductive layers in the substrate;
• and
• a protective package formed on the substrate and the electronic devices, the package leaving the first and second active surface portions of the die of each differential sensor device exposed.