Chip-type LED having an insulating substrate in which a first concave hole and a second concave hole are formed
AssigneeSharp Kabushiki Kaisha
InventorMakoto Matsuda
Life of this patent
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Abstract
An embodiment of the present invention has an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are formed, where a metallic sheet that serves as a first wiring pattern is formed at a portion that includes the first concave hole, a metallic sheet that serves as a second wiring pattern is formed at a portion that includes the second concave hole, an LED chip is mounted upon the metallic sheet inside the first concave hole, the LED chip is electrically connected to the metallic sheet inside the second concave hole via a metallic small-gauge wire, and the chip-type LED is sealed with a clear resin.
Claims7
A chip-type LED comprising:
- an insulating substrate in which a first concave hole and a second concave hole are formed;
- a metallic sheet that serves as a first wiring pattern and is formed at a portion that includes the first concave hole;
- a metallic sheet that serves as a second wiring pattern and is formed at a portion that includes the second concave hole;
- an LED chip mounted on the first wiring pattern inside the first concave hole;
- a metallic small-gauge wire electrically connecting the LED chip to the second wiring pattern inside the second concave hole;
- and
- a clear resin sealing the chip-type LED,
- wherein the first concave hole is not formed in the second concave hole, and the first wiring pattern covers a sidewall of the first concave hole, and
- the metallic sheet serving as the first wiring pattern and the metallic sheet serving as the second wiring pattern extend over and are exposed on a bottom surface of the insulating substrate so as not to be covered by any other material.
Dependencies are inferred from the claim text.