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US 8,134,083 B2Granted
Circuit carrier
AssigneeAB Mikroelektronik Gesselschaft mit beschrankter Haftung
InventorBernd Haegele
Life of this patent
Estimating the term…
Abstract
A circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the dielectric layer having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.
Claims16
A circuit carrier comprising:
- a metallic carrier layer;
- and
- a dielectric layer arranged on said metallic carrier layer in at least a region-wise manner,
- wherein said dielectric layer has a plurality of pores in a region, said pores being sealed with a substantially nonconductive glass at least on a side of said dielectric layer that is remote from said metallic carrier layer, and wherein a surface of said dielectric layer outside said region of said pores is substantially free from glass.
1 more element
Dependencies are inferred from the claim text.