Solid printed circuit board and method of manufacturing the same
AssigneePanasonic Corporation
InventorsTadashi Nakamura, Fumio Echigo, Takayuki Kita, Kota Fukasawa, Shogo Hirai
Life of this patent
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Abstract
A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.
Claims16
A solid printed circuit board comprising:
- an upper printed circuit board having a wiring on a surface thereof;
- a lower printed circuit board having a wiring on a surface thereon, the lower printed circuit board and the upper printed circuit board having shapes different from each other;
- a bonding layer connecting between the upper printed circuit board and the lower printed circuit board;
- and
- a solder resist provided around a peripheral edge of the bonding layer,
- wherein the bonding layer is made of insulating material containing resin, and has a via-conductor made of a conductive paste filling a through-hole perforated in the bonding layer,
- wherein the bonding layer has an area smaller than an area of the upper printed circuit board, and
- wherein the solder resist around the peripheral edge of the bonding layer protrudes from the lower printed circuit board.
A method of manufacturing a solid printed circuit board, comprising:
- providing an upper printed circuit board, a lower printed circuit board, a bonding layer, and a solder resist, the upper printed circuit board having a wiring formed on a surface thereof, the lower printed circuit board having a wiring formed on a surface thereof, the bonding layer being made of insulating material containing resin for bonding the upper printed circuit board to the lower printed circuit board the solder resist being provided around a peripheral edge of the bonding layer;
- cutting the upper printed circuit board and the bonding layer into predetermined shapes to form a solid structure;
- perforating a through-hole in the bonding layer;
- filling the through-hole with conductive paste;
- placing the bonding layer on one of the lower printed circuit board and the upper printed circuit board;
- and
- laminating the lower printed circuit board, the bonding layer, and the upper printed circuit board by applying heat and pressure,
- wherein the bonding layer has an area smaller than an area of the upper printed circuit board, and
- wherein the solder resist around the peripheral edge of the bonding layer protrudes from the lower printed circuit board.
A solid printed circuit board comprising:
- an upper printed circuit board having a wiring on a surface thereof;
- a lower printed circuit board having a wiring on a surface thereon, the lower printed circuit board and the upper printed circuit board having shapes different from each other;
- a bonding layer connecting between the upper printed circuit board and the lower printed circuit board;
- and
- an insulating film covering a portion of the bonding layer and a portion of the lower printed circuit board,
- wherein the bonding layer is made of insulating material containing resin, and has a via-conductor made of a conductive paste filling a through-hole perforated in the bonding layer.
A solid printed circuit board comprising:
- an upper printed circuit board having a wiring on a surface thereof;
- a lower printed circuit board having a wiring on a surface thereon, the lower printed circuit board and the upper printed circuit board having shapes different from each other;
- and
- a bonding layer connecting between the upper printed circuit board and the lower printed circuit board,
- wherein the bonding layer is made of insulating material containing resin, and has a via-conductor made of a conductive paste filling a through-hole perforated in the bonding layer, and
- wherein the bonding layer contains coloring agent.
A solid printed circuit board comprising:
- an upper printed circuit board having a wiring on a surface thereof;
- a lower printed circuit board having a wiring on a surface thereon, the lower printed circuit board and the upper printed circuit board having shapes different from each other;
- and
- a bonding layer connecting between the upper printed circuit board and the lower printed circuit board,
- wherein the bonding layer is made of insulating material containing resin, and has a via-conductor made of a conductive paste filling a through-hole perforated in the bonding layer,
- wherein the upper printed circuit board has frame shape, and
- wherein the solid printed circuit board has an overall thickness not larger than 400 μm.
Dependencies are inferred from the claim text.