Back to results
US 8,134,081 B2Granted
Three-dimensional circuit board and its manufacturing method
AssigneePanasonic Corporation
InventorsDaisuke Sakurai, Yoshihiko Yagi
Life of this patent
Estimating the term…
Abstract
A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.
Claims7
A three-dimensional circuit board comprising:
- a first wiring-electrode provided on a plurality of steps;
- and
- a second wiring-electrode connected to the first wiring-electrode at least in an altitude direction,
- wherein the first wiring-electrode and the second wiring-electrode are integrated continuously.
1 more element
Dependencies are inferred from the claim text.