Frit
AssigneeAsahi Glass Company, Limited
InventorAsahi Ide
Life of this patent
Estimating the term…
Abstract
The present invention provides a frit containing substantially no lead, which is applicable to a member having α of at most 50×10−7/° C. A frit comprising a low-melting point glass powder and a refractory filler powder, containing substantially no lead, having a thermal expansion coefficient of at most 50×10−7/° C., and being processable at 500° C. or lower, wherein the above low-melting point glass powder satisfies a softening pour point range of at least 30° C., and the above refractory filler powder satisfies the following relationship: 1<S×ρ<10 S: specific surface area (m2/g) ρ: density (g/cm3).
Claims6
A frit comprising a low-melting point glass powder, a refractory filler powder and a heat absorbent powder, wherein the frit comprises substantially no lead and has a thermal expansion coefficient of at most 50×10−7/° C., and is processable at 500° C. or lower, wherein the low-melting point glass powder has a softening pour point of at least 30° C., and the refractory filler powder satisfies the following relationship:
- 1<S×ρ<10, wherein
- S is a specific surface area (m2/g), and
- ρ is density (g/cm3),
- wherein the frit comprises from 45 to 65 vol % of the low-melting point glass powder, from 30 to 50 vol % of the refractory filler powder, and from 1 to 10 vol % of the heat absorbent powder.
Dependencies are inferred from the claim text.