Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate

A method for picking up semiconductor chips provided on a wafer table, in which a first camera detects the position of a provided semiconductor chip and a chip gripper held on a bonding head picks up the semiconductor chip, with the bonding head with the chip gripper being movable by means of a pick system according to a system of coordinates KS immanent to the pick system, the method comprising

• in a setup phase performing an adjustment of a first setpoint position of the bonding head, said first setpoint position located in the visual field of the first camera, the adjustment including
• moving the bonding head to the first setpoint position, and
• determining and storing the coordinates of the first setpoint position relating to the system of coordinates KS and the coordinates of the first setpoint position relating to a system of coordinates KS1 of the first camera, and
• in a production phase performing a readjustment of the first setpoint position at the occurrence of a predetermined event.