Methods and systems for barrier layer surface passivation

A method of depositing a gapfill copper layer onto a barrier layer, the method comprising:

• (a) forming the barrier layer on a surface of a substrate;
• (b) forming a removable passivated surface accomplished by deposition of at least one of cobalt, rhodium, rhenium, osmium, iridium, and molybdenum on the barrier layer;
• (c) removing the removable passivated surface from the barrier layer;
• and
• (d) depositing the gapfill copper layer onto the barrier layer;
• wherein removing the passivated surface is accomplished using a plasma etch process.

An integrated system for depositing a copper layer onto a barrier layer, the integrated system comprising:

• a barrier deposition module configured to form a barrier layer on a substrate;
• a passivated surface formation module configured to form a passivated surface on the barrier layer;
• a passivated surface removal module configured to remove the passivated surface from the barrier layer;
• a copper gapfill module configured to deposit a gapfill copper layer;
• and
• at least one transfer module configured for vacuum transfer of the substrate or controlled environment transfer of the substrate, the least one transfer module being coupled to the barrier deposition module, the passivated surface formation module, the passivated surface removal module, and the copper gapfill module and configured so that the substrate can be transferred between the modules substantially without exposure to an oxygen containing environment;
• wherein the passivated surface formation module is configured to subject the barrier layer to a reactive gas mixture containing at least one of the elements fluorine, bromine, and iodine.

An integrated system for depositing a copper layer onto a barrier layer, the integrated system comprising:

• a barrier deposition module configured to form a barrier layer on a substrate;
• a passivated surface formation module configured to:
• subject the barrier layer to a glow discharge containing at least one of the elements fluorine, bromine, and iodine;
• or
• deposit at least one of cobalt, rhodium, rhenium, osmium, iridium, ruthenium, and molybdenum;
• a passivated surface removal module configured to remove the passivated surface from the barrier layer;
• a copper gapfill module configured to deposit a gapfill copper layer;
• and
• at least one transfer module configured for vacuum transfer of the substrate or controlled environment transfer of the substrate, the least one transfer module being coupled to the barrier deposition module, the passivated surface formation module, the passivated surface removal module, and the copper gapfill module and configured so that the substrate can be transferred between the modules substantially without exposure to an oxygen containing environment.

An integrated system for depositing a gapfill copper layer onto a barrier layer, the integrated system comprising:

• a barrier deposition module configured to form a barrier layer on a substrate;
• a passivated surface formation module configured to form a passivated surface on the barrier layer;
• a passivated surface removal and copper deposition module configured to remove the passivated surface from the barrier layer and to deposit the copper layer onto the barrier layer;
• and
• at least one transfer module configured for vacuum transfer of the substrate or controlled environment transfer of the substrate, the least one transfer module being coupled to the barrier deposition module, the passivated surface formation module, and the passivated surface removal and copper deposition module so that the substrate can be transferred between the modules substantially without exposure to an oxygen-containing environment;
• wherein the passivated surface formation module is configured to subject the barrier layer to a reactive gas mixture containing at least one of the elements fluorine, bromine, and iodine.

An integrated system for depositing a gapfill copper layer onto a barrier layer, the integrated system comprising:

• a barrier deposition module configured to form a barrier layer on a substrate;
• a passivated surface formation module configured to form a passivated surface on the barrier layer;
• a passivated surface removal and copper deposition module configured to remove the passivated surface from the barrier layer and to deposit the copper layer onto the barrier layer;
• and
• at least one transfer module configured for vacuum transfer of the substrate or controlled environment transfer of the substrate, the least one transfer module being coupled to the barrier deposition module, the passivated surface formation module, and the passivated surface removal and copper deposition module so that the substrate can be transferred between the modules substantially without exposure to an oxygen-containing environment;
• wherein the passivated surface formation module comprises an atomic layer deposition module, a silicon deposition module, or a silicidation module.

An integrated system for depositing a copper layer onto a barrier layer, the integrated system comprising:

• a barrier deposition and passivated surface formation module configured to form a barrier layer on a substrate and configured to form a passivated surface on the barrier layer;
• a passivated surface removal and copper deposition module configured to remove the passivated surface from the barrier layer and to deposit a copper layer onto the barrier layer;
• and
• at least one of
• a vacuum transfer module and
• a controlled environment transfer module
• coupled to the barrier deposition and passivated surface formation module and the passivated surface removal and copper deposition module and configured so that the substrate can be transferred between the modules substantially without exposure to an oxide-forming environment;
• wherein the passivated surface is removable in an electroless copper deposition process and the passivated surface removal and copper deposition module is configured to deposit copper by electroless copper deposition or electroless copper deposition and electrochemical copper plating;
• the barrier deposition and passivated surface formation module is configured to deposit tantalum nitride by atomic layer deposition and to form a passivated surface on the tantalum nitride, the passivated surface is autocatalytic for electroless copper deposition;
• and the passivated surface removal and copper deposition module is configured to deposit copper by electroless copper deposition or electroless copper deposition and electrochemical copper plating.