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US 8,133,808 B2Granted
Wafer level chip package and a method of fabricating thereof
AssigneeTessera, Inc.
InventorsTeck-Gyu Kang, Belgacem Haba, Guilian Gao
Life of this patent
Estimating the term…
Abstract
Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.
Claims19
A method of fabricating a microelectronic element, comprising:
- (a) providing a substrate having a front surface and posts projecting from said front surface, said posts having sidewalls;
- and
- (b) applying a first dielectric material to the front surface so that said first dielectric material is deposited on the sidewalls of the posts to thereby form risers, each riser including a post and having a sloping surface defined by said first dielectric material, wherein the sloping surface of each riser as a whole is disposed at a lesser angle to the front surface than the sidewall as a whole of the post included in the riser;
- wherein said substrate has contact pads exposed at said front surface, the method further comprising forming conductive lines propagating from contact pads of the substrate to tips of the risers, said conductive lines extending over said sloping surfaces of said risers.
1 more element
A method of fabricating a microelectronic element, comprising:
- (a) providing a substrate having a front surface and posts projecting from said front surface, said posts having sidewalls;
- (b) applying a first dielectric material to the front surface so that said first dielectric material is deposited on the sidewalls of the posts to thereby form risers having tips remote from the front surface and having tip surfaces on the tips and sloping surfaces defined by said first dielectric material, the applying step including applying the first dielectric material in a flowable condition and curing the first dielectric material in the flowable condition to a solid condition, the risers having continuous smooth surfaces including the sloping surfaces and the tip surfaces;
- wherein said substrate has contact pads exposed at said front surface, the method further comprising forming conductive lines propagating from contact pads of the substrate to tips of the risers, said conductive lines extending over said sloping surfaces of said risers and said smooth surfaces.
Dependencies are inferred from the claim text.