Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system

A method of manufacturing an electronic apparatus, the method comprising:

• depositing a first conductive medium on a base to form at least one first conductor;
• depositing a plurality of semiconductor substrate particles suspended in a liquid or gel carrier medium, wherein the plurality of semiconductor substrate particles are inorganic and substantially spherical;
• forming one or more ohmic contacts between at least some semiconductor substrate particles of the plurality of semiconductor substrate particles and the at least one first conductor;
• converting at least some semiconductor substrate particles of the plurality of semiconductor substrate particles into a plurality of semiconductor diodes, wherein the plurality of semiconductor diodes are substantially spherical;
• depositing a second conductive medium to form a plurality of second conductors coupled to the plurality of semiconductor diodes;
• and
• depositing a plurality of lenses suspended in a first polymer over the plurality of semiconductor diodes, wherein the plurality of lenses are substantially spherical and have at least a first index of refraction and wherein the first polymer, when solidified or cured, has at least a second, different index of refraction.

A method of manufacturing an electronic apparatus, the method comprising:

• depositing a first conductive medium on a base to form at least one first conductor;
• depositing a plurality of semiconductor substrate particles suspended in a liquid or gel carrier medium, wherein the plurality of semiconductor substrate particles are inorganic and substantially spherical;
• forming one or more ohmic contacts between at least some semiconductor substrate particles of the plurality of semiconductor substrate particles and the at least one first conductor;
• depositing a dopant material onto the plurality of semiconductor substrate particles;
• converting at least some semiconductor substrate particles of the plurality of semiconductor substrate particles into a plurality of semiconductor diodes, wherein the plurality of semiconductor diodes are substantially spherical;
• depositing a second conductive medium to form a plurality of second conductors coupled to the plurality of semiconductor diodes, wherein the second conductive medium is substantially optically transmissive when solidified or cured;
• and
• depositing a plurality of lenses suspended in a first polymer over the plurality of semiconductor diodes, wherein the plurality of lenses are substantially spherical and have at least a first index of refraction and wherein the first polymer, when solidified or cured, has at least a second, different index of refraction.