Embedded inductor and method of producing thereof
AssigneeNpx B.V.
InventorsPeter Dirks, Klaas Heres
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Abstract
A method of manufacturing an inductor embedded into a semiconductor chip package (100) is described, which method comprises providing a carrier (102; 202; 302) having, between a first side and an opposite second side, a first conductive layer (104; 503), an intermediate layer (205; 505), a second conductive layer (106; 504), forming an inductor and contact pads for the chip by patterning the first conductive layer (104; 503) from the first side of the carrier (102; 202; 302), assembling the chip and providing an encapsulation (514) and forming terminals of the package, by patterning the second conductive layer (106; 504) from the second side of the carrier.
Claims10
A method of manufacturing an inductor embedded into a semiconductor chip package, which method comprises:
- providing a carrier having, between a first side and an opposite second side, a first conductive layer, an intermediate layer, and a second conductive layer,
- forming an inductor and contact pads for the chip by patterning the first conductive layer from the first side of the carrier;
- assembling a chip to the carrier and providing an encapsulation over the chip, further anchoring the inductor and the contact pads, and
- forming terminals of the package which are connected to at least some of the contact pads, by patterning the second conductive layer from the second side of the carrier.
A semiconductor package having an inductor embedded therein, the package comprising:
- a carrier having, between a first side and an opposite second side, a first conductive layer, an intermediate layer, and a second conductive layer;
- an inductor and contact pads patterned in the first conductive layer from the first side of the carrier;
- a chip assembled in the carrier, the chip and inductor in an encapsulation, the encapsulation anchoring the inductor and contact pads;
- and
- terminals of the package, the terminals connected to at least some of the contact pads, the terminals patterned by the second conductive layer from the second side of the carrier.
Dependencies are inferred from the claim text.