Leadframe
AssigneeMacronix International Co., Ltd.
InventorsJui-Chung Lee, Po-Hsin Lin, Kun-Feng Lee
Life of this patent
Estimating the term…
Abstract
A leadframe includes a die paddle and leads, in which the back side of the die paddle has a fillister. The fillister defines a rim surrounding a recess, and the recess accommodates protrusion of fusible material. Also, a package includes such a leadframe. Also, a method for making a leadframe includes patterning a sheet of metal to form a die paddle and leads, and forming a fillister in the back side of the die paddle.
Claims30
A leadframe, comprising a die paddle and leads, the die paddle having a die attach side and a back side, wherein the back side of the die paddle includes a fillister defining a rim surrounding a recess, wherein the recess defines a depth D, wherein D is at least about as great as an expected height of a protrusion of a plating material following pre-mount heat testing.
A semiconductor package, comprising a leadframe, the leadframe comprising a die paddle and leads, the die paddle having a die attach side and a back side, wherein the back side of the die paddle includes a fillister defining a rim surrounding a recess, wherein the recess defines a depth D, wherein D is at least about as great as an expected height of a protrusion of a plating material following pre-mount heat testing.
A method for making a leadframe comprising patterning a sheet of metal to form a die paddle and leads, and forming a fillister in the back side of the die paddle, the fillister defining a rim surrounding a recess, wherein the recess defines a depth D, wherein D is at least about as great as an expected height of a protrusion of a plating material following pre-mount heat testing.
A method for making a semiconductor leadframe package, comprising:
- patterning a sheet of metal to form a die paddle and leads;
- displacing the die paddle to form an upset die paddle;
- mounting a die on a die attach side of the die paddle and electrically connecting the die to leads to form an assembly;
- deploying a peripheral mold flow dam at a surface of the die paddle opposite the die attach side;
- and encapsulating the assembly, whereby the mold flow dam excludes encapsulant from a recess area of the die paddle, resulting in a recess at the area.
Dependencies are inferred from the claim text.