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US 8,133,754 B2Granted
Image sensor and method for manufacturing the same
AssigneeDongbu HiTek Co., Ltd.
InventorSeoung Hyun Kim
Life of this patent
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Abstract
An image sensor is disclosed that includes a first substrate including an electric junction region, a transistor, and a metal line connected to the electric junction region or the transistor; and a photodiode formed on the first substrate. The first substrate is formed at an upper portion thereof with a reflective layer to reflect light back to the photodiode.
Claims2
A method for manufacturing an image sensor, the method comprising:
- forming a circuitry including a metal line on a first substrate;
- and
- forming a photodiode on the metal line,
- wherein the forming of the circuitry on the first substrate comprises:
- forming an electric junction region and a transistor on the first substrate;
- forming a first interlayer dielectric layer on the electric junction region and the transistor;
- forming a metal layer and a reflective layer on the first interlayer dielectric layer sequentially;
- forming a reflective layer pattern and a metal pattern connecting the electric junction region or the transistor by selectively etching the metal layer and the reflective layer;
- forming a second interlayer dielectric layer on the reflective layer pattern;
- forming a contact hole in the second interlayer dielectric layer and the reflective layer pattern;
- and
- forming a metal contact in the contact hole passing through the reflective layer pattern and the second interlayer dielectric layer, the metal contact contacting a lower surface of the photodiode.
9 more elements
Dependencies are inferred from the claim text.