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US 8,133,654 B2Granted
Laser-decomposable resin composition and laser-decomposable pattern-forming material and flexographic printing plate precursor of laser engraving type using the same
AssigneeFUJIFILM Corporation
InventorAtsushi Sugasaki
Life of this patent
Estimating the term…
Abstract
A laser-decomposable resin composition of the invention contains a polyurethane resin having a structure wherein an aromatic group is directly connected to a urethane bond.
Claims21
A flexographic printing plate precursor of a laser engraving type comprising a heat-decomposable resin layer having a thickness of 0.05 to 10 mm comprising a cured laser-decomposable resin composition comprising a polymerizable compound and at least one of
- a polyurethane resin comprising, as a basic skeleton, a structural unit based on a reaction product of at least one diisocyanate compound represented by the formula (4) and at least one diol compound selected from the formulae (A-1) to (A-3), and
- polyurethane resin having a structure wherein an aromatic group is directly connected to a urethane bond and wherein an acetal site is present in a main chain:
- OCN—X0—NCO (4)
- HO—Ar1—OH (A-1)
- HO—(Ar1—Ar2)m—OH (A-2)
- HO—Ar1—X—Ar2—OH (A-3)
- wherein X0 represents a divalent organic residue;
- Ar1 and Ar2, which may be the same or different, each represents an aromatic ring which may have a substituent selected from an alkyl group, an aralkyl group, an aryl group, an alkoxy group, an aryloxy group and a halogen atom;
- X represents a divalent organic residue;
- and m is an integer of from 1 to 3.
7 more elements
A method for producing a flexographic printing plate precursor of a laser engraving type, comprising:
- forming, on a support, a heat-decomposable resin layer having a thickness of 0.05 to 10 mm with a laser-decomposable resin composition comprising a polymerizable compound and at least one of
- a polyurethane resin comprising, as a basic skeleton, a structural unit based on a reaction product of at least one diisocyanate compound represented by the formula (4) and at least one diol compound selected from the formulae (A-1) to (A-3), and
- a polyurethane resin having a structure wherein an aromatic group is directly connected to a urethane bond and wherein an acetal site is present in a main chain;
- and
- curing the heat-decomposable resin layer:
- OCN—X0—NCO (4)
- HO—Ar1—OH (A-1)
- HO—(Ar1—Ar2)m—OH (A-2)
- HO—Ar1—X—Ar2—OH (A-3)
- wherein X0 represents a divalent organic residue;
- Ar1 and Ar2, which may be the same or different, each represents an aromatic ring which may have a substituent selected from an alkyl group, an aralkyl group, an aryl group, an alkoxy group, an aryloxy group and a halogen atom;
- X represents a divalent organic residue;
- and m is an integer of from 1 to 3.
10 more elements
Dependencies are inferred from the claim text.