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US 8,133,560 B2Granted
Multilayer heat sealant structures, packages and methods of making the same
AssigneeBemis Company, Inc.
InventorsSuzanne E. Schaefer, Robert J. Blemberg, Roger P. Genske
Life of this patent
Estimating the term…
Abstract
The embodiments of the present invention relate to multilayer thermoplastic structures having improved sealability and tearability. More specifically, the present invention relates to a multilayer heat sealant structure having at least three layers that may be coextrusion coated or otherwise laminated to a substrate, such as metallized polymeric material, foil, or other substrates.
Claims12
A package for a product comprising:
- a first multilayer heat sealant structure and a second multilayer heat sealant structure, wherein each of the first and second multilayer heat sealant structures comprise a coextruded multilayer heat sealant structure comprising a low melt index layer comprising low density polyethylene and a high melt index layer comprising a single site catalyzed polyethylene wherein said single site catalyzed polyethylene has a melt index above about 10 g/10 min for use as a heat sealant layer wherein the high melt index layer is disposed adjacent to the low melt index layer, and further wherein the high melt index layer is coextruded with the low melt index layer and further wherein said low density polyethylene of the low melt index layer has a melt index lower than a melt index of the single site catalyzed polyethylene of the high melt index layer;
- and
- wherein at least a portion of the first multilayer heat sealant structure is sealed to at least a portion of the second multilayer heat sealant structure such that the high melt index layers of the first and second multilayer heat sealant structures abut each other.
Dependencies are inferred from the claim text.